Work

Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{\rm mm}^{2})$ Chips

Year: 2009

Type: article

Source: IEEE Transactions on Components and Packaging Technologies

DOI: 10.1109/tcapt.2009.2021256

Authors: Thomas Guangyin Lei, Jesus Noel Calata, Guo-Quan Lu, Xu Chen, Shufang Luo

Institutions: Virginia Tech, Tianjin University, NBE Tech (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2155421397

FWCI: 10.62

Cites: 18

Cited by: 251

Related to: 9