Work

Die Attach Materials for High Temperature Applications: A Review

Year: 2011

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2010.2100432

Authors: V R Manikam, Kuan Yew Cheong

Institution: Universiti Sains Islam Malaysia

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2156505933

FWCI: 13.55

Cites: 70

Cited by: 499

Related to: 10