Work

Scribe characterization vehicle test chip for ultra fast product wafer yield monitoring

Year: 2006

Type: conference-paper

Source: IEEE International Conference on Microelectronic Test Structures (ICMTS)

DOI: 10.1109/icmts.2006.1614285

Authors: C. Hess, A. Inani, Y. Lin, M. Squicciarini, R. Lindley, N. Akiya

Institution: PDF Solutions (United States)

Language: English

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2156694894

FWCI: 1.589

Cites: 13

Cited by: 9

Related to: 10