Work

Thermomechanical Reliability of Low-Temperature Sintered Silver Die Attached SiC Power Device Assembly

Year: 2006

Type: article

Source: IEEE Transactions on Device and Materials Reliability

DOI: 10.1109/tdmr.2006.882196

Authors: J.G. Bai, G.-Q. Lu

Institutions: University of Washington, Virginia Tech

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2157615424

FWCI: 4.529

Cites: 14

Cited by: 218

Related to: 10