Work

Monolithic 3D Integrated Circuits

Year: 2007

Type: conference-paper

Source: International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)

DOI: 10.1109/vtsa.2007.378923

Authors: Simon Wong, Abbas El-Gamal, Peter Griffin, Yoshio Nishi, Fabian Pease, James Plummer

Institution: Stanford University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2160007566

FWCI: 2.52

Cites: 8

Cited by: 113

Related to: 10