Work

Ag–Copper Structure for Bonding Large Semiconductor Chips

Year: 2008

Type: article

Source: IEEE Transactions on Components and Packaging Technologies

DOI: 10.1109/tcapt.2008.2002948

Authors: Jong Sung Kim, Pin J. Wang, Chin C. Lee

Institution: University of California, Irvine

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2160291683

FWCI:

Cites: 20

Cited by: 6

Related to: 10