Effect of Temperature on Water Molecules in a Model Epoxy Molding Compound: Molecular Dynamics Simulation Approach
Year: 2011
Type: article
Authors: Seung Geol Lee, Ji Il Choi, Wonsang Koh, Seung Soon Jang, Jongman Kim, Gene Kim
Institution: Georgia Institute of Technology
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2161691141