Work

High-Temperature Die Attachment Using Sn-Plated Zn Solder for Power Electronics

Year: 2015

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2015.2443058

Authors: Sungwon Park, Shijo Nagao, Yoshitaka Kato, Hiroshi Ishino, Kazuhiko Sugiura, Kazuhiro Tsuruta, Katsuaki Suganuma

Institutions: The Institute of Scientific and Industrial Research, The University of Osaka, The University of Osaka, Denso (Japan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Japan Society for the Promotion of Science

Award: Science of Hetero-Interface of Advanced Power Devises in Extreme Environments

OpenAlex ID: W2161868680

FWCI: 0.628

Cites: 26

Cited by: 12

Related to: 10