Work

Plasma altered layer model for plasma damage characterization of porous OSG films

Year: 2009

Type: conference-paper

Source: IEEE International Interconnect Technology Conference (IITC)

DOI: 10.1109/iitc.2009.5090345

Authors: H. Shi, H. Huang, J. Bao, J. Im, P. S. Ho, Y. Zhou, J. T. Pender, M. Armacost, D. Kyser

Institutions: The University of Texas at Austin, Applied Materials (United States)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2163701060

FWCI: 4.14

Cites: 3

Cited by: 7

Related to: 10