Dendrimers with Thermally Labile End Groups: An Alternative Approach to Chemically Amplified Resist Materials Designed for Sub-100 nm Lithography
Year: 2000
Type: article
Source: Advanced Materials
Authors: D. C. Tully, A. R. Trimble, J. M. J. Fréchet
Institution: University of California, Berkeley
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2167256343
