Work

Reflow and Electrical Characteristics of Nanoscale Solder

Year: 2006

Type: article

Source: Small

DOI: 10.1002/smll.200500296

Authors: Zhiyong Gu, Hongke Ye, Diana Smirnova, David Small, David H. Gracias

Institution: Johns Hopkins University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2170756554

FWCI: 2.364

Cites: 22

Cited by: 40

Related to: 10