Film transfer and bonding technique to cover lab on a chip
Year: 2005
Type: conference-paper
Authors: Jac Wan Kwon, S. Kamal-Bahl, Eun Sok Kim
Institution: University of Southern California
Language: English
Subfield: Biomedical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Funder: National Science Foundation
OpenAlex ID: W2171794468