Work

Multiscale thermal design of MCMs with high resolution unstructured adaptive simulation tools

Year: 2002

Type: conference-paper

Source: IEEE Multi-Chip Module Conference

DOI: 10.1109/mcmc.1997.569348

Authors: A.J. Przekwas, Y. Jiang, Z.Q. Tan

Institution: CFD Research Corporation (United States)

Language: English

Topic: Heat Transfer and Numerical Methods

Subfield: Computational Mechanics

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: Advanced Research Projects Agency

OpenAlex ID: W2172151208

FWCI: 1.162

Cites: 9

Cited by: 4

Related to: 10