Work

Enhanced interfacial thermal transport in pnictogen tellurides metallized with a lead-free solder alloy

Year: 2015

Type: article

Source: Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

DOI: 10.1116/1.4935446

Authors: Devender, Kelly Lofgreen, Shankar Devasenathipathy, Johanna Swan, Ravi Mahajan, Theodorian Borca-Tasciuc, Ganpati Ramanath

Institutions: Rensselaer Polytechnic Institute, Intel (United States)

Language: English

Topic: Advanced Thermoelectric Materials and Devices

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

Funders: National Science Foundation, Semiconductor Research Corporation, Division of Civil, Mechanical and Manufacturing Innovation, Division of Electrical, Communications and Cyber Systems

Awards: G6427111313, Collaborative Research: Understanding Mechanical and Thermal Properties and Their Coupling at Nanomolecularly Modified Metal-Ceramic Interfaces, COLLABORATIVE RESEARCH: MOSFETS WITH ATOMICALLY ENGINEERED METAL/HIGH-K INTERFACES

OpenAlex ID: W2173473572

FWCI: 0.24

Cites: 20

Cited by: 5

Related to: 10