Work

Effects of Dielectric Material, Aspect Ratio and Copper Plating on Microvia Reliability

Year: 2013

Type: article

Authors: T.K. Lesniewski, Northrop Grumman Corp.

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2184530270

FWCI: 0.196

Cites: 4

Cited by: 5

Related to: 10