Implantable Packaging Technique Featuring Through Wafer Interconnects and Low Temperature Direct Bond
Year: 2008
Type: conference-paper
Author: James Lee
Institution: Applied Microengineering Limited (United Kingdom)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2205009869