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A Path Toward Non-Destructive 3D Metrology for Through-Silicon Vias

Year: 2011

Type: conference-paper

Source: IMAPSource Proceedings

DOI: 10.4071/isom-2011-ta1-paper3

Authors: Jeff Gelb, LayWai Kong, Luke Hunter, Allen Gu, Tiffany Fong, Alain C. Diebold, S. H. Lau, Wenbing Yun

Institution: University at Albany, State University of New York

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2252859027

FWCI:

Cites: 3

Cited by: 5

Related to: 10