A study on forming a spacer for wafer-level CIS(CMOS Image Sensor) assembly
Year: 2008
Type: article
Authors: Il Hwan Kim, 나경환, 김현철, 전국진
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2258021392
