Work

Measurement of Adhesion Strength of Solid-state Diffusion Bonding Between Nickel and Copper by Means of Laser Shock Spallation Method

Year: 2009

Type: conference-paper

Source: AIP conference proceedings

DOI: 10.1063/1.3295001

Authors: M. Satou, H. Akamatsu, A. Hasegawa, Mark Elert, Michael D. Furnish, William W. Anderson, William G. Proud, William T. Butler

Institution: Tohoku University

Language: English

Topic: Advanced Welding Techniques Analysis

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2270872947

FWCI:

Cites: 4

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Related to: 10