Communication—Reaction Processes in Electroless Pd Deposition on Ni-P Surfaces Utilizing Formic Acid as Reducing Agent
Year: 2016
Type: article
Abstract: Herein, electroless Pd deposited on Ni-P surfaces using formic acid (FA) as a reducing agent was investigated. Open circuit potential with time (OCPT) and cyclic voltammetry (CV) results suggest that electroless Pd deposited on Ni-P surfaces occurs by a two stage reaction. First, Pd plating proceeds via a galvanic displacement reaction between Ni and Pd 2+ . Subsequently, Pd deposited via autocatalytic reaction takes place on Pd surfaces. When the displacement reaction was prevented, the autocatalytic deposition of palladium was incapable of proceeding; therefore, it is confirmed that the displacement reaction is a necessary prerequisite for occurrence of the autocatalytic reaction.
DOI: 10.1149/2.0941606jes
Authors: Bing Li, Ning Li, Deyu Li, Yanqing Wang
Institution: Harbin Institute of Technology
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: hybrid
Estimated APC paid: $1,950
OpenAlex ID: W2300886103