Work

Analysis for microstructure and mechanical property of Sn3Ag-0.5Cu solder joints in high density LED packages

Year: 2012

Type: article

Source: Transactions of the China Welding Institution

Author: Lei Yuanhong

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2348576010

FWCI:

Cites:

Cited by: 1

Related to: 10