Work

Recent Advances of Flip-Chip Underfill Process (1)

Year: 2008

Type: article

Source: Electronics & Packaging

Author: Qiang Huang

Institution: China Electronics Technology Group Corporation

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2350159546

FWCI:

Cites:

Cited by:

Related to: 10