Silicon hybrid integration
Year: 2011
Type: article
Source: SEMI-IR
Authors: Xianyao Li, Yuan Taonu, Shiqian Shao, Zujun Shi, Yi Wang, Yude Yu, Yu Jinzhong
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2353149660
