Work

An alternative approach for assessment of blind via holes

Year: 2011

Type: article

Source: Printed Circuit Information

Author: Bin He

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2353489999

FWCI:

Cites:

Cited by:

Related to: