Work

X-ray detection and analysis for micro voids of solder joints in high density LED packages

Year: 2012

Type: article

Source: Electronic Components and Materials

Authors: Xinxin Wang, Jianping Liu, Guo Fu, Li Liu, Fu Channi

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2364677272

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