Work

Wafer bonding: A flexible way to manufacture SOI materials for high performance applications

Year: 2004

Type: article

Source: Chalmers Publication Library (Chalmers University of Technology)

Authors: Stefan Bengtsson, Petra Amirfeiz, Mikael Johansson

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W237886435

FWCI:

Cites:

Cited by:

Related to: 10