Work

Board Level Reliability Issues in Ball & Column Mount for CBGA/CCGA Devices

Year: 2013

Type: article

Source: China Integrated Circuit

Author: Lin Peng-ron

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2382141771

FWCI:

Cites:

Cited by: 1

Related to: 10