Work

Color Biological Features-Based Solder Paste Defects Detection and Classification on Printed Circuit Boards

Year: 2012

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2012.2205149

Authors: Jun Jiang, Jun Cheng, Dacheng Tao

Institutions: Chinese Academy of Sciences, Shenzhen Institutes of Advanced Technology, University of Technology Sydney

Language: English

Topic: Industrial Vision Systems and Defect Detection

Subfield: Industrial and Manufacturing Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2052545764

FWCI: 4.401

Cites: 39

Cited by: 44

Related to: 10