Work

Integration of Molecular Components into Silicon Memory Devices

Year: 2004
Type: article
Abstract: Consumer and business appetite for electronic devices drives the semiconductor industry’s need for miniaturization. The state of the art of semiconductor devices now has critical feature dimensions substantially less than 0.1 μm. While many devices can be manufactured effectively at such dimensions through the continued extension and optimization of existing process technologies, it is uncertain at what point along the path of miniaturization such devices, which rely on the bulk properties of materials, will retain the required functional characteristics.
Language: English
Open Access status: bronze
OpenAlex ID: W2472595855
FWCI: 0.623
Cites: 1
Cited by: 9
Related to: 10