Work

A new wafer pre-alignment method in MEMS thermopile detector wafer level test system

Year: 2016

Type: conference-paper

Source: Mechanics and Mechanical Engineering

DOI: 10.1142/9789813145603_0082

Authors: Zhen-Yu Wang, Tao Pan, Yu-Xin Ye, Bin-Bin Jiao, Yan-Mei Kong

Institutions: Peking University, Chinese Academy of Sciences, Institute of Microelectronics

Language: English

Topic: Advanced MEMS and NEMS Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2473271561

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