Work

Plastic BGA Package and Direct Filter Attachment for CMOS Thermal Imagers

Year: 2001

Type: book-chapter

Source: Springer eBooks

DOI: 10.1007/978-3-642-59497-7_46

Authors: M. Waelti, A. Schaufelbühl, O. Brand, H. Baltes

Institution: ETH Zurich

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2480713579

FWCI:

Cites: 8

Cited by: 3

Related to: 10