Work

Fabrication technique of a compressible biocompatible interconnect using a thin film transfer process

Year: 2011

Type: article

Source: Journal of Micromechanics and Microengineering

DOI: 10.1088/0960-1317/21/7/074012

Authors: A A A Aarts, O Srivannavit, K D Wise, E Yoon, R Puers, C Van Hoof, H P Neves

Institutions: University of Michigan, IMEC, KU Leuven

Language: English

Topic: Advanced MEMS and NEMS Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2120331090

FWCI: 2.319

Cites: 26

Cited by: 20

Related to: 10