Work

Optimization of TEM Sample Preparation to Reduce the Overlapping of TEM Images

Year: 2014

Type: conference-paper

Source: Proceedings - International Symposium for Testing and Failure Analysis

DOI: 10.31399/asm.cp.istfa2014p0425

Authors: Shuqing Duan, Summer Chen, Paul Yu, Ming Li, Mark Zhang, Kary Chien

Institution: Semiconductor Manufacturing International (China)

Language: English

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2530493669

FWCI: 0.405

Cites:

Cited by: 1

Related to: 10