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Challenges and advances in use-condition-based mechanical reliability test development

Year: 2003

Type: conference-paper

Source: International Conference on Electronic Packaging Technology (ICEPT)

DOI: 10.1109/eptc.2003.1298762

Authors: L.L. Mercado, S. Sahasrabudhe, E. Monroe

Institution: Intel (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2532845897

FWCI:

Cites: 7

Cited by:

Related to: 10