Work

Key attributes and solutions of CMP process for advanced Cu damascene interconnects

Year: 2004

Type: conference-paper

Source: IEEE International Conference on Solid-State and Integrated Circuit Technology

DOI: 10.1109/icsict.2004.1435057

Author: Shumin Wang

Institution: Cabot Microelectronics (United States)

Language: English

Topic: Advanced Surface Polishing Techniques

Subfield: Biomedical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2534659560

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