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Kinetic Study of Disulfide Molecular Film Deposition for Cu-EMC Adhesion Promotion

Year: 2006

Type: conference-paper

Source: IEEE/CPMT International Electronics Manufacturing Technology Symposium

DOI: 10.1109/iemt.2006.4456503

Authors: Cell K Y Wong, Min Zheng, Bing Xu, Matthew M F Yuen

Institution: Hong Kong University of Science and Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2540654653

FWCI:

Cites: 8

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Related to: 10