Work

A Study of Interfacial Moisture Diffusion at Metal/Epoxy Interface by FTIR Technique

Year: 2006

Type: conference-paper

Source: International Conference on Electronic Materials and Packaging

DOI: 10.1109/emap.2006.4430618

Authors: Edward K L Chan, Matthew M F Yuen

Institution: Hong Kong University of Science and Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2541190270

FWCI: 0.53

Cites: 10

Cited by: 2

Related to: 10