Work

An investigation of sealant materials for display modules subjected to temperature and humidity conditions

Year: 2005

Type: conference-paper

Source: International Conference on Polymers and Adhesives in Microelectronics and Photonics

DOI: 10.1109/polytr.2004.1402769

Authors: P. Griffin, J.J. Leahy, J. Punch, T. Galkin, E. Elonen, O. Rusanen

Institutions: University of Limerick, Nokia (Finland)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2544731304

FWCI:

Cites: 3

Cited by:

Related to: 10