Work

A virtual prototyping environment for multi-scale, multi-disciplinary simulation of electronics packaging of MCMs

Year: 2002

Type: conference-paper

Source: I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems

DOI: 10.1109/itherm.1996.534583

Authors: A.J. Przekwas, Y. Jiang, M.M. Athavale, Z.J. Wang, J. van der Zijp

Institution: CFD Research Corporation (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: Advanced Research Projects Agency

OpenAlex ID: W2545887915

FWCI:

Cites: 2

Cited by: 2

Related to: 10