Work

Packaging and Reliability of Power Modules

Year: 2014

Type: article

Author: Josef Lutz

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Industry, innovation and infrastructure, Affordable and clean energy

Open Access status: closed

OpenAlex ID: W2556099539

FWCI: 2.268

Cites: 7

Cited by: 54

Related to: 10