Reliability of Ag-Sintering and Sn-Ag TLP-Bonding for Mounting of SiC and GaN Devices
Year: 2016
Type: conference-paper
Authors: Adeel Bajwa, Juergen Wilde
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2568885880