Work

Rheology of Thermal Interface Materials Composed of Silicone Gels

Year: 2017

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2016.2646385

Authors: K. Chano, G. M. Poliskie, J. Fregoso

Language: English

Topic: Thermal properties of materials

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2581155541

FWCI: 0.214

Cites: 17

Cited by: 10

Related to: 10