Work

Microstructural Evolution in Thermally Cycled Large-Area Lead and Lead-Free Solder Joints

Year: 2002

Type: article

Author: Kelly L. Stinson-Bagby

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2589609446

FWCI:

Cites: 45

Cited by: 11

Related to: 10