Work

Development of a Wire Bonding Process for Microsystems Fabricated From Polyvinyl Acetate - Nanocomposite

Year: 2011

Type: article

Source: OhioLink ETD Center (Ohio Library and Information Network)

Author: Andrew Barnes

Institution: Case Western Reserve University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: green

OpenAlex ID: W2596870221

FWCI:

Cites: 36

Cited by:

Related to: 10