Work

Highly integrated power electronic converters using active devices embedded in printed-circuit board

Year: 2015

Type: conference-paper

Abstract: In this paper, we present a short overview of the power dies interconnects based on PCB technology, then we focus on embedding of power dies in the PCB material. In the second part of the article, we present in details the technology we developed to embed dies in PCB. Results show that the electrical performance of the die remains satisfying after embedding, but that dies with a copper topside metal layer are required for this process.

Source: HAL

Authors: Yu, Chenjiang, Buttay, Cyril, Labouré, Eric, Bley, Vincent, Combettes, Céline

Institutions: Université Paris-Saclay, Laboratoire de Génie Électrique et Électronique de Paris, Laboratoire Ampère, Laboratoire Plasma et Conversion d'Energie, École Nationale Supérieure d'Électrotechnique, d'Électronique, d'Informatique, d'Hydraulique et des Télécommunications

Language: English

Topic: Advanced DC-DC Converters

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: green

Funders: Agence Nationale de la Recherche, CHIST-ERA

OpenAlex ID: W2597316779