Work

Selected-area growth of nickel micropillars on aluminum thin films by electroless plating for applications in microbolometers

Year: 2017

Type: article

Abstract: An optimization process of electroless plating of nickel was carried out with NiCl 2 as the nickel ion source, NaH 2 PO 2 as the reduction agent, CH 3 COONa and Na 3 C 6 H 5 O 7 as complexing agents. Electroless plated nickel layers on sputtered aluminum corning glass substrates with a resistivity of about 75.9 μΩ cm and a nickel concentration higher than 93% were obtained. This optimum process was successfully applied in growing nickel micropillars at selected areas with a well-controlled height. The microstructure of the masking layers was fabricated by means of optical photolithography for subsequent growth of nickel micropillars on selected areas. Micropillars size was defined by the opening size and the height was controlled by adjusting the plating time at a growth rate of 0.41 μm/min. This result shows that electroless nickel plating could be a good candidate for growing micropillars for applications in microbolometers.

Source: Journal of Science Advanced Materials and Devices

DOI: 10.1016/j.jsamd.2017.05.004

Authors: Do Ngoc Hieu, Dang Nguyen Ha My, Vu Thi Thu, Nguyen Quoc Hung, Do Ngoc Chung, Nguyen-Tran Thuat