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A Novel Nanoparticle Additive for Enhanced Copper CMP Performance

Year: 2006

Type: conference-abstract

Source: ECS Meeting Abstracts

DOI: 10.1149/ma2005-01/6/317

Authors: Sameer Deshpande, Swanand Patil, Satyanarayana Kuchibhatla, Sudipta Seal

Institution: University of Central Florida

Language: English

Topic: Advanced Surface Polishing Techniques

Subfield: Biomedical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: bronze

OpenAlex ID: W2626819690

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