Year: 2017
Type: article
Abstract: The solid-liquid method was used to prepare the continuous casting of copper cladding aluminium by liquid aluminum alloy and solid copper, and the interfacial phase formation of Al-Cu bimetal at different pouring temperatures (700, 750, 800 °C) was investigated by means of metallograph, scanning electron microscopy (SEM) and energy dispersive spectrometry (EDS) methods. The results showed that the pouring temperature of aluminum melt had an important influence on the element diffusion of Cu from the solid Cu to Al alloy melt and the reactions between Al and Cu, as well as the morphology of the Al-Cu interface. When the pouring temperature was 800 °C, there were abundant Al-Cu intermetallic compounds (IMCs) near the interface. However, a lower pouring temperature (700 °C) resulted in the formation of cavities which was detrimental to the bonding and mechanical properties. Under the conditions in this study, the good metallurgical bonding of Al-Cu was achieved at a pouring temperature of 750 °C.
Source: China Foundry
Institutions: Dalian University of Technology, Bohai University
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: gold
Estimated APC paid: $2,990
OpenAlex ID: W2627056359