Work

Heat dissipation performance of graphene enhanced electrically conductive adhesive for electronic packaging

Year: 2017

Type: conference-paper

Source: IMAPS Nordic Conference on Microelectronics Packaging (NordPac)

DOI: 10.1109/nordpac.2017.7993177

Authors: Yiqun Yang, Hui Ye, Wei Ke, Shirong Huang, Nan Wang, Xiuzhen Lu, Jie Bao, Lilei Ye, Johan Liu

Institutions: Shanghai University, Chalmers University of Technology, Huangshan University, Smart High Tech (Sweden)

Language: English

Topic: Thermal properties of materials

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2744381504

FWCI: 2.091

Cites: 18

Cited by: 3

Related to: 10