Work

Effect of Au powder morphology on properties of gold paste film

Year: 2016

Type: article

Source: Electronic Components and Materials

Authors: Chengfeng Li, Haizhen Wang, Guo Mingy, Xiu Zhang, Yulong Du

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2750485140

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